UNIVERSAL MAGNETIC REBALLING PLATFORM 2UUL BH11

2UUL BH11 MAGNETIC REBALLING PLATFORM

The 2UUL BH11 universal magnetic platform is designed for precision BGA reballing, IC and CPU reballing, and soldering the middle layers of iPhone and Android smartphone motherboards. Powerful magnets stabilize the stencils, preventing them from warping or bulging due to heat. The high-temperature-resistant design allows for direct hot-air operations.

Product Features:

• Strong magnetic adhesion—Ensures immediate positioning and a secure hold on BGA stencils without the risk of shifting during solder paste application.
• Protection against stencil warping—Stable adhesion prevents stencil deformation, facilitating the formation of uniform solder balls and extending stencil life.
• Double-sided grooves—With depths of 1 mm and 2 mm, they facilitate stable mounting and positioning of PCBs and laminates of various thicknesses.
• High thermal resistance—Durable construction designed for direct heating with a hot-air soldering iron.

Technical Specifications:

• Model: 2UUL BH11
• Device type: Universal magnetic platform for BGA reballing
• Profile depth: 1 mm / 2 mm
• Applications: Reballing CPUs, ICs, middle layers, and PCB repairs (iPhone / Android)
• Features: Neodymium magnets, high-temperature resistance

Package contents:

1x 2UUL BH11
magnetic platform 2x Spatula / scraper for applying solder paste