MOBI DESOLDERING WICK 2MM 1.5M SET 5PCS DW01 2UUL

COPPER TAPE / BRAID FOR TIN REMOVAL — MOBi DESOLDERING WICK (2.0 mm x 1.5 m / SET OF 5)

Mobi 2UUL DW01 copper braid from the 2015 series. Designed for precise cleaning of solder pads, removing excess flux from PCBs, and repair work on smartphones. The dense, flat copper weave ensures immediate thermal conductivity, rapid tin absorption, and minimal flux residue after use.

Product Features:

• Dense copper weave—Ensures instant heat transfer and effective solder removal without fraying the edges.
• Optimal width (2.0 mm) — A versatile size for standard repair work on logic boards and SMD sockets.
• Lower risk of overheating—Rapid tin absorption reduces the contact time between the soldering iron tip and delicate PCB traces.

Technical Specifications:

• Model: 2UUL DW01 Mobi (2015 version)
• Tape width: 2.0 mm
• Roll length: 1.5 m
• Material: High-absorbency pure copper braid
• Applications: Tin removal, cleaning PCB/BGA pads, service micro-soldering

Kit contents:

5x 2UUL DW01 Mobi Desoldering Tape 2.0 mm x 1.5 m